Modern electronics industry, ultra-precision polishing is the soulPhysical polishing is the most commonly used polishing technique before the 1980s, but the rapid development of the electronics industry places increasingly stringent requirements on the size and flatness of material devices. When a substrate having a thickness of one millimeter needs to be fabricated into an integrated circuit of several hundred thousand layers, the conventional old polishing process is far from satisfactory.“In the case of wafer fabrication, polishing is the last step in the entire process. The goal is to improve the micro-defects left in the process before wafer processing to achieve the best parallelism.” Dr. Wang Qi from the National Institute of Nanoscience, Chinese Academy of Sciences Science and Technology Daily reporter introduced.Today's level of optoelectronic information industry, the parallelism of sapphire, monocrystalline silicon and other materials as optoelectronic substrate materials is becoming more and more precise, and has reached the nanometer level. This means that the polishing process has also entered the nano-scale ultra-precision.How important is the ultra-precision polishing process in modern manufacturing, and its field of application can directly explain the problem: integrated circuit manufacturing, medical equipment, auto parts, digital parts, precision molds, aerospace.The mission of ultra-precision polishing technology in the modern electronics industry is not only to flatten different materials, but also to flatten multiple layers of materials, so that a few millimeters of silicon wafers are formed by this 'global flattening'. A very large scale integrated circuit composed of millions of transistors. For example, the computer invented by humans has changed fr...